MINIATURE/MICROMINIATURE (2M) REPAIR PROGRAM AND HIGH-RELIABILITY SOLDERING LEARNING OBJECTIVES Upon completion of this topic, the student will be able to: 1. State the purpose and need for training and certification of 2M repair technicians. 2. Explain the maintenance levels at which maintenance is performed. 3. Identify the specialized and general test equipment used in fault […]
Continue reading…
Introduction to Microelectronics
Miniature/Micro miniature (2m) Repair Program and High-Reliability Soldering.
MINIATURE/MICROMINIATURE (2M) REPAIR PROGRAM AND HIGH-RELIABILITY SOLDERING LEARNING OBJECTIVES Upon completion of this topic, the student will be able to: 1. State the purpose and need for training and certification of 2M repair technicians. 2. Explain the maintenance levels at which maintenance is performed. 3. Identify the specialized and general test equipment used in fault […]
Continue reading…
Microelectronics: Interconnections In Printed Circuit Boards, Modular Assemblies, Environmental Considerations and Electrical Considerations.
INTERCONNECTIONS IN PRINTED CIRCUIT BOARDS As electronic systems become more complex, interconnections between components also becomes more complex. As more components are added to a given space, the requirements for interconnections become extremely complicated. The selection of conductor materials, insulator materials, and component physical size can greatly affect the performance of the circuit. Poor choices […]
Continue reading…
Microelectronics: Interconnections In Printed Circuit Boards, Modular Assemblies, Environmental Considerations and Electrical Considerations.
INTERCONNECTIONS IN PRINTED CIRCUIT BOARDS As electronic systems become more complex, interconnections between components also becomes more complex. As more components are added to a given space, the requirements for interconnections become extremely complicated. The selection of conductor materials, insulator materials, and component physical size can greatly affect the performance of the circuit. Poor choices […]
Continue reading…
Microelectronics: Microelectronic System Design Concepts, Terminology and System Packaging.
MICROELECTRONIC SYSTEM DESIGN CONCEPTS You should understand the terminology used in microelectronics to become an effective and knowledgeable technician. You should be familiar with packaging concepts from a maintenance standpoint and be able to recognize the different types of assemblies. You should also know the electrical and environmental factors that can affect microelectronic circuits. In […]
Continue reading…
Microelectronics: Microelectronic System Design Concepts, Terminology and System Packaging.
MICROELECTRONIC SYSTEM DESIGN CONCEPTS You should understand the terminology used in microelectronics to become an effective and knowledgeable technician. You should be familiar with packaging concepts from a maintenance standpoint and be able to recognize the different types of assemblies. You should also know the electrical and environmental factors that can affect microelectronic circuits. In […]
Continue reading…
Microelectronics: Equivalent Circuits,J-K Flip-Flop And Ic Sizes,Ic Package Lead Identification (Numbering) And Ic Identification.
EQUIVALENT CIRCUITS At the beginning of this topic, we discussed many applications of microelectronics. You should understand that these applications cover all areas of modern electronics technology. Microelectronic ICs are produced that can be used in many of these varying circuit applications to satisfy the needs of modern technology. This section will introduce you to […]
Continue reading…
Microelectronics: Equivalent Circuits,J-K Flip-Flop And Ic Sizes,Ic Package Lead Identification (Numbering) And Ic Identification.
EQUIVALENT CIRCUITS At the beginning of this topic, we discussed many applications of microelectronics. You should understand that these applications cover all areas of modern electronics technology. Microelectronic ICs are produced that can be used in many of these varying circuit applications to satisfy the needs of modern technology. This section will introduce you to […]
Continue reading…
Microelectronics: Packaging Techniques And Recent Developments In Packaging.
PACKAGING TECHNIQUES Once the IC has been produced, it requires a housing that will protect it from damage. This damage could result from moisture, dirt, heat, radiation, or other sources. The housing protects the device and aids in its handling and connection into the system in which the IC is used. The three most common […]
Continue reading…
Microelectronics: Packaging Techniques And Recent Developments In Packaging.
PACKAGING TECHNIQUES Once the IC has been produced, it requires a housing that will protect it from damage. This damage could result from moisture, dirt, heat, radiation, or other sources. The housing protects the device and aids in its handling and connection into the system in which the IC is used. The three most common […]
Continue reading…